The main reason for PCBA processing solder joint failure

The main reasons for the failure of PCBA processing solder joints:

1. Poor component pins: plating, pollution, oxidation, coplanarity;

2. Bad PCB pads: plating, pollution, oxidation, warpage;

3. Solder quality defects: composition, impurity exceeding standard, oxidation;

4. Flux quality defects: low solderability, high corrosion, low SIR;

5. Process parameter control defects: design, control, equipment;

6. Defects of other auxiliary materials: adhesives, cleaning agents.

How to improve the reliability of PCBA solder joints:

For PCBA solder joint reliability experiment work, including reliability experiment and analysis, its purpose is to evaluate and appraise the reliability level of PCBA integrated circuit devices on the one hand, and to provide parameters for the reliability design of the whole machine; on the other hand, it is to Improve the reliability of solder joints during PCBA processing. This requires necessary analysis of failed products to find out the failure mode and analyze the cause of the failure. The purpose is to correct and improve the design process, structural parameters, welding process and increase the yield rate of PCBA processing. PCBA solder joint failure mode The prediction of cycle life is very important and is the basis for establishing its mathematical model