Why use red glue for patch processing?

Why use red glue for patch processing?

Patch processing adhesive is patch processing red glue, which is usually red (yellow or white). The adhesive such as hardener, pigment and solvent is evenly distributed in the paste. It is mainly used to fix the patch processing components on the printed board. It is generally distributed by glue dispensing or steel screen printing. Put the components into the oven or reflow soldering furnace for heating and hardening.

Patch processing patch glue solidifies after heating. The solidification temperature of patch processing is generally 150 degrees, and it will not melt after heating. In other words, the thermal hardening process of patch processing is irreversible. The patch processing effect will vary with different thermal curing conditions, connected objects, equipment used and operating environment. When using, the patch adhesive shall be selected according to the printed circuit board assembly (PCBA processing) process.

Patch processing red glue is a chemical compound, mainly composed of polymer materials. Patch processing filler, curing agent, other additives, etc. Patch processing red glue has viscosity, fluidity, temperature characteristics, wetting characteristics and so on. According to the characteristics of red glue for patch processing, the purpose of using red glue in production is to make the parts firmly stick to the PCB surface and prevent them from falling.

Patch processing red glue is a pure consumable material and is not a necessary process product. Now, with the continuous improvement of surface mounting design and process, through-hole reflow welding and double-sided reflow welding of patch processing have been realized, and the mounting process of patch processing patch glue is becoming less and less.