Bluetooth PCBA Service Development Manufactures Pcba Assembly OEM/ODM Services: Layers 1-22 layersMin. line width2milMax.board size (single&doule 700*1200mmMin.annular ring width: vias3milsided)
Bluetooth PCBA Service Development Manufactures Pcba Assembly
OEM/ODM Services:
Layers 1-22 layers Min. line width 2mil
Max.board size (single&doule 700*1200mm Min.annular ring width: vias 3mil
sided)
Surface finish HAL(with Pb free),plated Ni/Au, Min.board thickness(multilayer) 4layers:0.4mm;
Immersion silver,Imm Ni/Au,Imm Sn, 6layers:0.6mm;
hard gold,OSP,ect 8layers:1mm;
10layers:1.2mm
Board materials FR-4; high Tg; high CTI; halogen free; high frequency(rogers,taconic, Plating thickness (Technique: Plating type: Imm Ni, Min./Max thickness:100/150U'' Plating type: Imm Au, Min./Max thickness:2/4U''
PTFE,nelcon, Immersion Ni/Au)
ISOLA,polyclad 370 HR); thick copper
Impedance control ± 10% Distance between Outline: 0.2mm V-CUT: 0.4mm
line to board edge
Base copper thickness(Inner Min. thickness:1/3 OZ Max.thickness:6OZ Min.hole size(board thickness ≥2mm) Aspect ratio≤16
and outer layer)
Finished copper thickness Outer layers: Max.board thickness(single&doule sided) 6mm
Min.thickness 1 OZ,
Max.thickness 10 OZ
Inner layers:
Min.thickness 0.5OZ,
Max.thickness 6 OZ
