Influence of single chip microcomputer chip manufacturing process on chip yield

The influence of single chip microcomputer chip production technology on the yield of single chip microcomputer chip is very important. These factors can be refined to the number of single chip microcomputer chip process steps, single chip microcomputer production process cycle, packaging and final testing, which all affect the yield of single chip microcomputer chip process.

Influence of single chip microcomputer chip manufacturing process on chip yield

It shows the influence of the above three points on the performance of single chip microcomputer.

Influence of single chip microcomputer chip manufacturing process on chip yield

The number of process steps of single chip microcomputer chip. The number of process steps is considered to be a limiting factor in the yield of the wafer factory's cum. The more steps, the more likely it is to break the wafer or misoperate the wafer. This conclusion is also applicable to wafer yield. With the increase of the number of process steps, the wafer background defect density will increase unless corresponding measures are taken to reduce the impact. The increased background defect density will affect more chips and reduce the yield of wafer electrical testing.

Single chip microcomputer chip process cycle. The actual processing time of wafer in production can be calculated in days. However, due to the temporary slowdown caused by queuing at various process stations and process problems, wafers usually stay in the production area for several weeks. The longer the wafer waiting time, the more likely it is to be contaminated and reduce the yield of electrical measurement. The transformation to real-time production mode is an attempt to improve the yield and reduce the related costs caused by the increase of production line stock.

Single chip microcomputer chip packaging and final test yield. After the wafer electrical measurement is completed, the single chip microcomputer chip wafer enters the packaging process, is cut into a single chip and packaged into a protective shell. It also includes multiple visual inspection and quality inspection of packaging process in a series of steps.

After the completion of the packaging process, the packaged chip will undergo a series of physical, environmental and electrical tests, which are collectively referred to as the final test. After the final test, the third main yield is calculated, that is, the ratio of the number of qualified chips in the final test to the number of qualified chips in the wafer electrical test.

To sum up, the yield of single chip microcomputer production is guaranteed through various production links, and the single chip microcomputer chip processing technology is rigorous and linked.