OEM/ODM Services:Layers 1-22 layersMin. line width2milMax.board size (single&doule 700*1200mmMin.annular ring width: vias3milsided)Surface finishHAL(with Pb free),plated Ni/Au,Min.board thickness(
| OEM/ODM Services: | |||
| Layers | 1-22 layers | Min. line width | 2mil |
| Max.board size (single&doule | 700*1200mm | Min.annular ring width: vias | 3mil |
| sided) | |||
| Surface finish | HAL(with Pb free),plated Ni/Au, | Min.board thickness(multilayer) | 4layers:0.4mm; |
| Immersion silver,Imm Ni/Au,Imm Sn, | 6layers:0.6mm; | ||
| hard gold,OSP,ect | 8layers:1mm; | ||
| 10layers:1.2mm | |||
| Board materials | FR-4; high Tg; high CTI; halogen free; high frequency(rogers,taconic, | Plating thickness (Technique: | Plating type: Imm Ni, Min./Max thickness:100/150U'' Plating type: Imm Au, Min./Max thickness:2/4U'' |
| PTFE,nelcon, | Immersion Ni/Au) | ||
| ISOLA,polyclad 370 HR); thick copper | |||
| Impedance control | ± 10% | Distance between | Outline: 0.2mm V-CUT: 0.4mm |
| line to board edge | |||
| Base copper thickness(Inner | Min. thickness:1/3 OZ Max.thickness:6OZ | Min.hole size(board thickness ≥2mm) | Aspect ratio≤16 |
| and outer layer) | |||
| Finished copper thickness | Outer layers: | Max.board thickness(single&doule sided) | 6mm |
| Min.thickness 1 OZ, | |||
| Max.thickness 10 OZ | |||
| Inner layers: | |||
| Min.thickness 0.5OZ, | |||
| Max.thickness 6 OZ |
